Union Minister Ashwini Vaishnaw described the agreement as a significant step towards establishing a robust and resilient complete value chain in the semiconductor sector.
India and Japan have recently entered into a Memorandum of Understanding (MoU) to collaborate on semiconductor development. This partnership will encompass various aspects, such as design, manufacturing, equipment research, and talent development in the semiconductor industry.
Union Minister Ashwini Vaishnaw described the agreement as a significant step towards establishing a robust and resilient complete value chain in the semiconductor sector.
“The MoU is on five fronts, viz. semiconductor design, manufacturing, equipment research, talent development, and bringing resilience to the semiconductor supply chain,” said Vaishnaw.
Union Minister emphasized that agreements like the U.S.-India initiative on Critical and Emerging Technology (iCET) and the one with Japan offer clear directional support during talks between industries from both countries. The government’s strategy is evidently centred on supporting industries in India, whether collaborating with the US or Japan, focusing on fostering growth and innovation in critical and emerging technologies.
He further revealed that discussions are underway to finalize a similar agreement with the Japanese company Rapides.
In addition, he highlighted the rapid growth of the semiconductor industry, currently surpassing USD 650 million, and anticipated to reach USD 1 billion within the next five to six years. To meet the surging demand, the industry requires a substantial talent pool and significant growth at multiple locations. Japan perceives India as a dependable partner, possessing complementary strengths, making it an ideal collaboration prospect to address the industry’s needs and leverage mutual advantages.
Further Union Minister emphasized the importance of advanced packaging in the semiconductor industry, stating that the future of semiconductor development will involve sophisticated packaging at various levels. India’s strength lies in its strong design capabilities, boasting over 50 plus designs, making it an appealing destination for semiconductor manufacturing.
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India is to sign agreements with institutions like Georgia Tech University, he noted and has already signed one with Caldwell University to build talent for advanced packaging.
After the Japan MoU, other major players have also shown interest in India’s semiconductor sector. Micron Technology plans to invest USD 2.75 billion to set up a semiconductor unit, while Applied Materials will invest USD 400 million in establishing a collaborative R&D centre. These investments signify the growing confidence in India’s semiconductor industry and its potential for further development and growth.